The XY4100LD SoC paper has been selected for ISSCC 2025, showcasing XINYISEMI's innovative strength in global chip design
From February 16 to 20, 2025, the IEEE International Solid-State Circuits Conference (ISSCC) was held at the San Francisco Marriott Marquis Hotel in the United States. XINYISEMI, with its innovative research achievements based on the XY4100LD SoC, joining global technology giants such as Samsung, MediaTek, Intel, and TSMC at the conference, demonstrating company’s innovative strength in the field of chip design.
As the most influential academic conference in the global integrated circuit field, ISSCC is hailed as the "Olympics" of the integrated circuit industry, attracting top companies and academic institutions from around the world each year. This year, ISSCC received a record-high 914 paper submissions, with an acceptance rate of only 26.9%. Ultimately, only 246 papers from 96 institutions across 14 countries were successfully selected.
At the conference, XINYISEMI presented a paper titled "A 28nm Multimode Multiband RF Transceiver with Harmonic-Rejection TX and Spur-Avoidance RX Supporting LTE Cat.1bis." The selected paper focuses on its independently developed XY4100LD SoC, a high-performance, ultra-low-power 4G LTE Cat.1 bis SoC specifically designed for Internet of Things (IoT) applications.
Core Competitiveness of XY4100LD:
QFN Package: The XY4100LD adopts a low-cost QFN-packaged LTE Cat.1bis chip solution, which offers significant advantages over the traditional BGA packages commonly used in the industry. Building on the QFN package, the chip also delivers outstanding and competitive performance in terms of circuit technology innovation, performance, and die area.
Ultra-Low Power Design: The XY4100LD features an advanced low-power architecture that enables efficient data processing at extremely low power consumption, making it particularly suitable for IoT devices that require long-term operation, such as smart meters, smart fire protection, smart payment systems, intelligent transportation, the sharing economy, and location tracking.
High Integration and Miniaturization: The XY4100LD chip integrates multiple modules including RF, baseband, and power management, significantly reducing the complexity of peripheral circuitry while shrinking the chip size, thus enabling the miniaturization and lightweight design of terminal devices.
Robust Security Performance: Addressing the security requirements of IoT devices, the XY4100LD SoC incorporates a multi-layered security protection mechanism, including hardware encryption, secure boot, and tamper resistance, ensuring data security and privacy.
The launch of the XY4100LD SoC provides a more competitive solution for the global IoT industry.
As the premier conference in the global integrated circuit field, ISSCC maintains extremely stringent paper acceptance standards, and the papers selected represent the most cutting-edge technologies and innovative achievements in chip design worldwide. The selection of the XY4100LD paper for ISSCC marks a significant milestone for XINYISEMI in technological innovation and product development, and also signifies that XINYISEMI is gradually making its mark on the global stage.
XINYISEMI has not only demonstrated its technological leadership in the IoT chip sector but also showcased its competitiveness in the global integrated circuit industry. This further enhances the company's brand influence in the international market and lays a solid foundation for expanding into overseas markets.
For more information:
As early as 2020, a paper co-authored by the company, titled "A 57nW Software-Defined Always-On Wake-Up Chip for IoT Devices with Asynchronous Pipelined Event-Driven Architecture and Time-Shielding," was successfully selected for the ISSCC conference for the first time, and was presented on-site by the company's founder, Dr. Xiao Jianhong.
